: Guangdong Taijin Semiconductor Technology Co., Ltd

A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold

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Aluminum DIP29 MGP Mold With Surface Polishing High Rigidity

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Semiconductor Molding Machine [25]
Trim And Form Machine [25]
IC Lead Frame Stamping Mold [19]
MGP Mold [30]
Trimming Forming Dies [25]
Mold Chase [6]
Semiconductor Molding Equipment [25]
Chip Sorting Machine [25]

Guangdong Taijin Semiconductor Technology Co., Ltd

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Aluminum DIP29 MGP Mold With Surface Polishing High Rigidity

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Aluminum DIP29 MGP Mold With Surface Polishing High Rigidity

DIP29 MGP Mold Main packaging form To series: T0220/263/247/252/3p, etc.; SOP series: SOP4/6/8/8/1 0/12/14/16/20/28;; DIP series: DIP4/8/14/16/18/23/24/25/29/40; SOT series: SOT23/25/26/223/89;; SOD ...

Product Tags:

DIP29 MGP Mold

Aluminum MGP Mold

Surface Polishing MGP Mould

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