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Guangdong Taijin Semiconductor Technology Co., Ltd
A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold
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Aluminum DIP29 MGP Mold With Surface Polishing High Rigidity

Guangdong Taijin Semiconductor Technology Co., Ltd
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Aluminum DIP29 MGP Mold With Surface Polishing High Rigidity

Aluminum DIP29 MGP Mold With Surface Polishing High Rigidity

DIP29 MGP Mold Main packaging form To series: T0220/263/247/252/3p, etc.; SOP series: SOP4/6/8/8/1 0/12/14/16/20/28;; DIP series: DIP4/8/14/16/18/23/24/25/29/40; SOT series: SOT23/25/26/223/89;; SOD ...

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DIP29 MGP Mold

      

Aluminum MGP Mold

      

Surface Polishing MGP Mould

      
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