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Guangdong Taijin Semiconductor Technology Co., Ltd
A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold
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Semiconductor Industry IC Packaging Equipment Chip Molding System Automated

Guangdong Taijin Semiconductor Technology Co., Ltd
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Semiconductor Industry IC Packaging Equipment Chip Molding System Automated

Semiconductor Industry IC Packaging Equipment Chip Molding System Automated

Chip Molding System Semiconductor packaging equipment is mainly used in TO, SOP, SSOP, TSSOP, DIP, SOT, ESOT, SOD, QFN, SMA, SMC, SMBF, MBF, JA, QFP, IPM, BGAPDFNOFP and other semiconductor devices, ...

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