: Guangdong Taijin Semiconductor Technology Co., Ltd

A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold

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Semiconductor Industry IC Packaging Equipment Chip Molding System Automated

Product Categories

Semiconductor Molding Machine [25]
Trim And Form Machine [25]
IC Lead Frame Stamping Mold [19]
MGP Mold [30]
Trimming Forming Dies [25]
Mold Chase [6]
Semiconductor Molding Equipment [25]
Chip Sorting Machine [25]

Guangdong Taijin Semiconductor Technology Co., Ltd

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Semiconductor Industry IC Packaging Equipment Chip Molding System Automated

Contact Now

Semiconductor Industry IC Packaging Equipment Chip Molding System Automated

Chip Molding System Semiconductor packaging equipment is mainly used in TO, SOP, SSOP, TSSOP, DIP, SOT, ESOT, SOD, QFN, SMA, SMC, SMBF, MBF, JA, QFP, IPM, BGAPDFNOFP and other semiconductor devices, ...

Product Tags:

Semiconductor Industry IC Packaging Equipment

Semiconductor Industry Chip Molding System

IC Packaging Equipment Automated

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